Laser dicer Oxford Lasers A-Series
Technologies for ensuring the dies to be properly interconnected and packaged with high precision, accuracy and reliability to eliminate damage of dies and enable easily manipulation. Supporting inspection technologies should provide the possibility of optical surface monitoring and inspection of interconnection and soldering process. Electrical characterization probe station is also planned, as well as temperature dependencies and working stress testing of fabricated dies.
Specification
| Laser | Diode-pumped solid-state Nd: YAG |
|---|---|
| Wavelength | 532 nm – prime wavelength (residual output at 532, 800 & 1064nm – see laser manual) |
| Average Power | 10W @ 40 kHz (532nm) measured at laser head |
| Pulse Frequency | 1 – 200 kHz |
| Pulse Duration | 10 ns (nominal) at 10kHz |
Details
Type of access
Full-service (paid),
Self-service
Research area
Devices
Category
Packaging
Subcategory
Dicing
Guarantor
Potoček, Michal
Site
CEITECNANO
Location
CEITEC Nano - C1.20