Laser dicer Oxford Lasers A-Series
Technologies for ensuring the dies to be properly interconnected and packaged with high precision, accuracy and reliability to eliminate damage of dies and enable easily manipulation. Supporting inspection technologies should provide the possibility of optical surface monitoring and inspection of interconnection and soldering process. Electrical characterization probe station is also planned, as well as temperature dependencies and working stress testing of fabricated dies.
Specification
| Laser | Diode-pumped solid-state Nd: YAG |
|---|---|
| Wavelength | 532 nm – prime wavelength (residual output at 532, 800 & 1064nm – see laser manual) |
| Average Power | 10W @ 40 kHz (532nm) measured at laser head |
| Pulse Frequency | 1 – 200 kHz |
| Pulse Duration | 10 ns (nominal) at 10kHz |
Gallery
Publications
KOLLER, P.; ASTNER, T.; TISSOT, B.; BURKARD, G.; TRUPKE, M., 2025: Strain-enabled control of the vanadium qudit in silicon carbide. PHYSICAL REVIEW MATERIALS 9 (4), p. 46104,772233796 - 46104,772233796, doi: 10.1103/PhysRevMaterials.9.L043201 (LASER-DICER)
Koňařík, L., 2024: Development and fabrication of microelectromechanical systems MEMS. BACHELOR'S THESIS, p. 1 - 46 (LASER-DICER, DWL, EVAPORATOR, RIE-FLUORINE, DRIE, NANOCALC, DEKTAK, WIRE-BONDER, LYRA)