Wire bonder TPT HB 16
Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding. The welding process is realized by wire attached to the substrate by bonding tool at the end of ultrasonic transducer, which is getting closer to certain distance to the sample surface. To achieve enhanced welding capability, sample is heated up to a certain temperature, for most processes being in the range from 20 °C to 250 °C. Attachment techniques defined by bonder tools are performed by wedge-wedge, ball-wedge, ribbon and bump bonding class.
Specification
Methods
- Ultrasonic, thermocompression and thermosonic capability - sample size up to 100 x 150 mm2 - ultrasonic transducer (62 kHz, up to 5 W power) - sample (chip) holder heated up to 250 °C, bonding tool heatable - gold or AlSi wires with diameters from 17 μm up to 75 μm and up to 25 μm x 250 μm ribbon compatible - adjustable wire loop between first and second bond with motorized holder movement - controlling software allows possibility to store up to 100 recipesGallery
Publications
Procházka, P., 2018: Fabrication of graphene and study of its physical properties. PH.D. THESIS, p. 1 - 139 (ALD-FIJI, DIENER, EVAPORATOR, MIRA-EBL, PECVD, WIRE-BONDER)
CHMELA, O.; SADÍLEK, J.; SAMA, DOMENECH-GIL, G.; J.; SOMER, J.; MOHAN, R.; ROMANO-RODRIGUEZ, A.; HUBÁLEK, J.; VALLEJOS VARGAS, S., 2018: Selectively arranged single-wire based nanosensor array systems for gas monitoring. NANOSCALE 10 (19), p. 9087 - 10, doi: 10.1039/c8nr01588k (RAITH, DWL, KAUFMAN, MAGNETRON, SCIA, RIE-FLUORINE, WIRE-BONDER, RIGAKU3)